48 lines
1.8 KiB
Markdown
48 lines
1.8 KiB
Markdown
# Change Log
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All notable changes to this project will be documented in this file.
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The format is based on [Keep a Changelog](http://keepachangelog.com/).
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## [v2.4] - 2019-04-16
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### Added
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- Added four extra test points on the bottom copper layer for the section-to-section resistive test. (TP20, TP21, TP76, TP77). Copper change only, nothing else moved.
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## [v2.3] - 2019-03-20
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### Changed
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- The Drive and Measure MCUs now have a control pin to control their Listen/Send status on the CAN Bus
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- The Control MCU now also has a pin to control its Listen/Send status on the CAN Bus
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- R162 and R159 were changed from 10k to 18k to allow better listen/send control
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- Enabled some quite sensible design rules that were apparently never enabled. Then also cleaned up the mess it found.
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### Added
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- R19 to improve Listen/Send control from the Control MCU
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- A very large number of test-pads to facilitate production test/test-ok.
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## [v2.2] - 2019-01-16
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### Changed
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- Switch input signals were modified to have double caps, to avoid leakage current through wear or damage, simultaneously the diodes were replaced by TVS clamping diodes.
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## [v2.1] - 2018-11-26
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### Added
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- Thermal Sensor
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## [v2.0] - 2018-06-18
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### Changed
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- Changed all components to DI library based.
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- Changed several pull-ups to 100k for power saving.
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### Added
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- Added an I2C Thermal Sensor to the Control microcontroller.
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- Added an 5V enable signal on pin PA07
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- Minor Version resistors allowing 8 levels of minor version.
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- Variants
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- Labeling of "DRV/MEAS/CTRL" to the board next to headers and processors.
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### Removed
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- Removed the individual control of all CAN enable and on/off lines and combined them all to IO pin PA06.
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- Removed the versioning on the Drive and Measure processors, as these make hardly any sense. |