1.8 KiB

Raw Permalink Blame History

Change Log

All notable changes to this project will be documented in this file.

The format is based on Keep a Changelog.

[v2.4] - 2019-04-16

Added

Added four extra test points on the bottom copper layer for the section-to-section resistive test. (TP20, TP21, TP76, TP77). Copper change only, nothing else moved.

[v2.3] - 2019-03-20

Changed

The Drive and Measure MCUs now have a control pin to control their Listen/Send status on the CAN Bus
The Control MCU now also has a pin to control its Listen/Send status on the CAN Bus
R162 and R159 were changed from 10k to 18k to allow better listen/send control
Enabled some quite sensible design rules that were apparently never enabled. Then also cleaned up the mess it found.

Added

R19 to improve Listen/Send control from the Control MCU
A very large number of test-pads to facilitate production test/test-ok.

[v2.2] - 2019-01-16

Changed

Switch input signals were modified to have double caps, to avoid leakage current through wear or damage, simultaneously the diodes were replaced by TVS clamping diodes.

[v2.1] - 2018-11-26

Added

Thermal Sensor

[v2.0] - 2018-06-18

Changed

Changed all components to DI library based.
Changed several pull-ups to 100k for power saving.

Added

Added an I2C Thermal Sensor to the Control microcontroller.
Added an 5V enable signal on pin PA07
Minor Version resistors allowing 8 levels of minor version.
Variants
Labeling of "DRV/MEAS/CTRL" to the board next to headers and processors.

Removed

Removed the individual control of all CAN enable and on/off lines and combined them all to IO pin PA06.
Removed the versioning on the Drive and Measure processors, as these make hardly any sense.