# Change Log
All notable changes to this project will be documented in this file.

The format is based on [Keep a Changelog](http://keepachangelog.com/).

## [v2.4] - 2019-04-16

### Added
- Added four extra test points on the bottom copper layer for the section-to-section resistive test. (TP20, TP21, TP76, TP77). Copper change only, nothing else moved.

## [v2.3] - 2019-03-20

### Changed
- The Drive and Measure MCUs now have a control pin to control their Listen/Send status on the CAN Bus
- The Control MCU now also has a pin to control its Listen/Send status on the CAN Bus
- R162 and R159 were changed from 10k to 18k to allow better listen/send control
- Enabled some quite sensible design rules that were apparently never enabled. Then also cleaned up the mess it found.

### Added
- R19 to improve Listen/Send control from the Control MCU
- A very large number of test-pads to facilitate production test/test-ok.

## [v2.2] - 2019-01-16

### Changed
- Switch input signals were modified to have double caps, to avoid leakage current through wear or damage, simultaneously the diodes were replaced by TVS clamping diodes.

## [v2.1] - 2018-11-26

### Added
- Thermal Sensor

## [v2.0] - 2018-06-18

### Changed
- Changed all components to DI library based.
- Changed several pull-ups to 100k for power saving.

### Added
- Added an I2C Thermal Sensor to the Control microcontroller.
- Added an 5V enable signal on pin PA07
- Minor Version resistors allowing 8 levels of minor version.
- Variants
- Labeling of "DRV/MEAS/CTRL" to the board next to headers and processors.

### Removed
- Removed the individual control of all CAN enable and on/off lines and combined them all to IO pin PA06.
- Removed the versioning on the Drive and Measure processors, as these make hardly any sense.